Evaluating Next-Gen Power Packaging: How Top-Side Cooling Performs
Effective thermal management is essential for improving the performance and reliability of power electronics. A recent article in Power Systems Design, co-authored by Sebastian Klötzer, Ilian B from Nexperia, and Maurizio Tranchero & Paolo Santero from I&M, examines the thermal performance of three different Top-Side Cooled (TSC) packages.
The evaluation compared these packages in terms of heat dissipation, power density, and overall thermal efficiency. The results showed that the Nexperia CCPAK1212i package delivered the best thermal performance, making it a strong candidate for applications requiring high power efficiency and reliability.
As part of the HiPE project, we aim to contribute to a deeper understanding of advanced power packaging solutions, helping to drive innovation in thermal management and high-performance power electronics.
Read the full article: A Top-Side Cooled Package to Best Dissipate Heat